Flexible heat dissipation module

ABSTRACT

A flexible heat dissipation module comprises at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part, wherein the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe. With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability and more flexible programmability to adapt to existing narrow device space.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention provides a flexible heat dissipation module, especially a flexible heat dissipation module consisting of heat pipes and flexible component combination.

2. Brief Description of the Related Art

To meet increasing efficiency requirement, the power of existing PC products such as desktop computers, notebooks, AIOs, and their monitor devices keeps rising. The foregoing situation leads to a severer heat dissipating standard. Existing heat dissipation methods, usually using a heat dissipation device with radiating fans, are of less efficiency; hence, heat pipes are sometimes used in combination with heat dissipation devices to provide better heat dissipation effect for high power requirement.

However, the heat pipes used in existing heat dissipation modules are only capable of bending to a certain degree due to their intrinsic structural limit Over-bending, wave curving, or double folding might damage the wick structure inside the heat pipe, decreasing the efficiency of heat conduction and even causing the breakdown of the heat pipe itself. Hence, heat dissipation designs could only be projected within the limitation, which results in the large size of electronic devices.

At the present day, due to technological advancement and increasing market need of lighter and smaller products, current devices and new inventions are often of smaller size. While their device space gets narrower and more complex, their functions are enhanced. More heat is generated in consequence, which renders the installation of heat dissipation modules more and more difficult. In order to allow these devices to perform more stably, the requirement for higher programmability of heat dissipation module installation and higher heat dissipation efficiency has increased to a standard which existing heat dissipation modules cannot satisfy. Hence, to provide a heat dissipation module with wider installation applicability and more flexible programmability which meets the required heat dissipating standard is an issue that the PC industry is facing.

In view of the foregoing considerations, the present invention attempts to solve the foregoing problems and improve the foregoing disadvantages.

SUMMARY OF THE INVENTION

In order to overcome the deficiencies of the preceding prior art, it is an object of the present invention to provide a flexible heat dissipation module consisting of flexible components, which provides wider installation applicability, more flexible programmability, and a good heat dissipation effect for products with narrow and complex device space, thereby overcoming the increasing difficulties in heat dissipation module installation.

It is a further object of the present invention to provide a flexible heat dissipation module with heat pipes, which can effectively and rapidly conduct heat from heat generating components to heat dissipating components and provide a stable heat dissipation effect.

With the above objects in mind, the present invention is a flexible heat dissipation module comprising at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining parts. The first and the second joining parts are respectively attached to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe.

With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability, more flexible programmability, and a good heat dissipation effect to apply to various narrow and complex device space.

BRIEF DESCRIPTION OF THE DRAWINGS

The technique, device, and effectiveness of the present invention will now be illustrated by way of its preferred embodiment with reference to the accompanying drawings. It is to be understood that the preferred embodiment serves only as an example here and does not limit the scope of the present invention.

FIG. 1 is a schematic representation of the preferred embodiment of the flexible heat dissipation module according to the present invention;

FIG. 2 is a schematic representation of another preferred embodiment of the flexible heat dissipation module according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1 and 2, a flexible heat dissipation module 100 according to the preferred embodiment of the present invention comprises at least one first heat pipe 23, one second heat pipe 24, and one flexible component 25. The first heat pipe 23 includes a first heat absorbing end 231 and a first heat dissipating end 232; the second heat pipe 24 includes a second heat absorbing end 241 and a second heat dissipating end 242.

The flexible component 25, which is made of highly heat-conductive and flexible composite material, includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining parts. The first joining part is attached to the first heat dissipating end 232 of the first heat pipe 23, and the second joining part is attached to the second heat absorbing end 241 of the second heat pipe 24. The surface of the flexible area can be planar or of corrugated or uneven design.

As the first heat absorbing end 231 of the first heat pipe 23 contacts with a heat generating component 21, it absorbs the heat generated by the heat generating component 21. The heat is then conducted by the first heat dissipating end 232 of the first heat pipe 23 to the flexible component 25, therefrom it is further transmitted to the second heat absorbing end 241 and the second heat dissipating end 242 of the second heat pipe 24. Final outward dissipation of heat is achieved by means of the heat dissipating component 22. The disposition of flexible components allows the heat dissipation module according to the present invention to bend, twist, and fold more easily, and enhances its flexible programmability for existing narrow device space.

With the objects of the present invention in mind, the specifications and parameters (such as number, length, and shape) of heat pipes and flexible components are not fixed but adjustable for different situations in accordance with actual application needs.

While the invention has been described with reference to a preferred embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined in the appended claims. 

1. A flexible heat dissipation module, comprising at least: a first heat pipe having a first heat absorbing end and a first heat dissipating end; a second heat pipe having a second heat absorbing end and a second heat dissipating end; and a flexible component having a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part; wherein, the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe.
 2. The flexible heat dissipation module as defined in claim 1, wherein the first heat absorbing end of the first heat pipe contacts a heat generating component.
 3. The flexible heat dissipation module as defined in claim 1, wherein the second heat dissipating end of the second heat pipe is attached to a heat dissipating component.
 4. The flexible heat dissipation module as defined in claim 1, wherein the surface of the flexible component is planar or of a corrugated or uneven design. 